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How To Detect Trace Metals During Semiconductor Manufacturing

The front cover of Perkin Elmer's app note about metallic impurity analysis
Credit: PerkinElmer

As semiconductor devices become increasingly miniaturized and sophisticated, preventing metal contamination in fabrication chemicals has become critical for maintaining yields and device performance. 


Traditional inductively coupled plasma mass spectrometry (ICP-MS) analysis of organic solvents – like N-methyl-2-pyrrolidone (NMP) – requires time-consuming acid digestion or distillation pretreatment. These procedures, in addition, can introduce contaminants that compromise the quality of the semiconductor.


This application note demonstrates how advanced multi-quadrupole ICP-MS technology can revolutionize ultra-pure NMP analysis for effective semiconductor manufacturing quality control.


Download this app note to discover how to:

  • Minimize contamination in trace metal analysis of organic solvents
  • Eliminate the need for complex sample prep
  • Achieve sub-ppt detection limits for 37 critical metallic impurities


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